Yıl 2018, Cilt 22, Sayı 5, Sayfalar 1211 - 1220 2018-10-01

Effect of Diffusion Annealing Temperature on Crack-initiating Omnipresent Flaws, Void/crack Propagation and Dislocation Movements Along Ni Surface-layered Bi-2223 Crystal Structure

Tahsin Turgay [1] , Gürcan Yıldırım [2]

159 297

This study aims to find out the crucial variations in the mechanical performance and characterization of Bi-2223 superconducting compounds with the diffusion annealing temperatures interval 650 °C-850 °C by means of Vickers hardness measurements exerted at the different applied indentation test loads (0.245 N-2.940 N) and derived theoretical findings. All the experimental measurement results and theoretical evidences declare that the mechanical characterization and performance are obtained to improve with the increment in the diffusion annealing temperature up the value of 700 °C as a consequence of decrement in the grain boundary coupling problems, local structural distortions, grain misorientations, lattice strains, lattice defects, disorders and dislocations in the adjacent layers. Namely, the optimum annealing temperature of 700 °C resulting in the optimum penetration of Ni impurities into both the superconducting grains and over the grain boundaries develops the crystallinity of Bi-2223 crystal structure. In other words, the surface energy related to the crack-initiating omnipresent flaws, void/crack propagation and dislocation movement reduces due to the augmented critical stress value. In this respect, the diffusion annealing temperature of 700 °C develops the mechanical durability, stiffness, ideal fracture and flexural strength. However, after the certain diffusion annealing temperature value of 700 °C, the crystallinity tends to degrade considerably and in fact dwelling in the worst crystal structure for 850 °C annealing temperature. Accordingly, the initial crack growths, sizes of crack-producing flaws, void/crack propagation and dislocation movement in the copper-oxide consecutively stacked layers reach much more rapidly to the critical speeds due to the increased stress amplification so that the Bi-2223 compound with the augmented brittle behavior breaks at even lower test load. Moreover, it is observed that the presence of optimum nickel impurities in the crystal structure strengthens the standard indentation size effect behavior.

Bi-2223 crystal structure, Ni impurity diffusion, annealing temperature, cracks/voids, dislocations
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Birincil Dil en
Konular Makine Mühendisliği
Yayımlanma Tarihi Ekim 2018
Dergi Bölümü Araştırma Makalesi
Yazarlar

Yazar: Tahsin Turgay
Kurum: SAKARYA ÜNİVERSİTESİ
Ülke: Turkey


Yazar: Gürcan Yıldırım
Kurum: ABANT İZZET BAYSAL ÜNİVERSİTESİ
Ülke: Turkey


Bibtex @araştırma makalesi { saufenbilder341709, journal = {Sakarya University Journal of Science}, issn = {1301-4048}, eissn = {2147-835X}, address = {Sakarya Üniversitesi}, year = {2018}, volume = {22}, pages = {1211 - 1220}, doi = {10.16984/saufenbilder.341709}, title = {Effect of Diffusion Annealing Temperature on Crack-initiating Omnipresent Flaws, Void/crack Propagation and Dislocation Movements Along Ni Surface-layered Bi-2223 Crystal Structure}, key = {cite}, author = {Turgay, Tahsin and Yıldırım, Gürcan} }
APA Turgay, T , Yıldırım, G . (2018). Effect of Diffusion Annealing Temperature on Crack-initiating Omnipresent Flaws, Void/crack Propagation and Dislocation Movements Along Ni Surface-layered Bi-2223 Crystal Structure. Sakarya University Journal of Science, 22 (5), 1211-1220. DOI: 10.16984/saufenbilder.341709
MLA Turgay, T , Yıldırım, G . "Effect of Diffusion Annealing Temperature on Crack-initiating Omnipresent Flaws, Void/crack Propagation and Dislocation Movements Along Ni Surface-layered Bi-2223 Crystal Structure". Sakarya University Journal of Science 22 (2018): 1211-1220 <http://www.saujs.sakarya.edu.tr/issue/31265/341709>
Chicago Turgay, T , Yıldırım, G . "Effect of Diffusion Annealing Temperature on Crack-initiating Omnipresent Flaws, Void/crack Propagation and Dislocation Movements Along Ni Surface-layered Bi-2223 Crystal Structure". Sakarya University Journal of Science 22 (2018): 1211-1220
RIS TY - JOUR T1 - Effect of Diffusion Annealing Temperature on Crack-initiating Omnipresent Flaws, Void/crack Propagation and Dislocation Movements Along Ni Surface-layered Bi-2223 Crystal Structure AU - Tahsin Turgay , Gürcan Yıldırım Y1 - 2018 PY - 2018 N1 - doi: 10.16984/saufenbilder.341709 DO - 10.16984/saufenbilder.341709 T2 - Sakarya University Journal of Science JF - Journal JO - JOR SP - 1211 EP - 1220 VL - 22 IS - 5 SN - 1301-4048-2147-835X M3 - doi: 10.16984/saufenbilder.341709 UR - http://dx.doi.org/10.16984/saufenbilder.341709 Y2 - 2017 ER -
EndNote %0 Sakarya University Journal of Science Effect of Diffusion Annealing Temperature on Crack-initiating Omnipresent Flaws, Void/crack Propagation and Dislocation Movements Along Ni Surface-layered Bi-2223 Crystal Structure %A Tahsin Turgay , Gürcan Yıldırım %T Effect of Diffusion Annealing Temperature on Crack-initiating Omnipresent Flaws, Void/crack Propagation and Dislocation Movements Along Ni Surface-layered Bi-2223 Crystal Structure %D 2018 %J Sakarya University Journal of Science %P 1301-4048-2147-835X %V 22 %N 5 %R doi: 10.16984/saufenbilder.341709 %U 10.16984/saufenbilder.341709
ISNAD Turgay, Tahsin , Yıldırım, Gürcan . "Effect of Diffusion Annealing Temperature on Crack-initiating Omnipresent Flaws, Void/crack Propagation and Dislocation Movements Along Ni Surface-layered Bi-2223 Crystal Structure". Sakarya University Journal of Science 22 / 5 (Ekim 2018): 1211-1220. http://dx.doi.org/10.16984/saufenbilder.341709